I wasn’t sure how to decap it at first because I’m used to working with ICs encapsulated in standard black epoxy-glass molding compounds. I thought briefly about chemical methods, grinding, and machining before coming across MIL-STD-1580D section 12, which called for grinding or machining through most of the metal lid, thinning it down to the point that a handheld blade can make the final cut.
长城脚下的“临时爸妈”：目送孩子们走出大山
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